Overmoulding with hotmelt adhesives is a halfway house between traditional injection moulding and potting.
The process greatly simplifies the production of final packaging solutions for the enclosure of electronic components on assembled printed circuit boards, together with injection moulding of cable assembly plug connectors to provide simultaneous sealing and strain relief.
Complex, time-consuming processes can now be replaced with a technically efficient and cost-effective method.
In automotive engineering, hotmelts have been state of the art for watertight plug connections for several years. And now hotmelt adhesives are also increasingly making inroads in those areas where assembled printed circuit boards have to be protected from moisture, mechanical damage or an aggressive environment.
The reason for this is the low pressure applied and hence gentle treatment of the components. This yields the following advantages over 2-component moulding (PU or epoxy):
The Low Pressure Overmoulding Process