EC Electronics is participating in Subcon 2014 in June to highlight its extensive design for manufacture (DFM), specialist manufacturing and low-pressure overmoulding (LPO) capabilities. Visitors to stand A22 will be able to view demonstrations of LPO manufacturing, handle examples of the technique and discuss applications with the experts. “EC Electronics is the first UK EMS company to offer LPO services to encase and protect our customer’s assemblies and we are looking forward to demonstrating the techniques and its benefits throughout Subcon 2014,” said Sarah McNamara, sales manager at EC Electronics. “2014 is a milestone year for us as we celebrate our 30th successful year. Participating in Subcon for the first time will provide us with a dynamic platform to build on that success and to meet existing customers and connect with potential new customers who are looking for innovative manufacturing services.” LPO is an innovative encapsulation process that quickly produces high quality, rugged, lightweight assemblies using an injection process. Virtually any product that has a need to seal and environmentally protect its electronics could be applicable to low pressure overmoulding. Tooling is usually a two-part custom aluminium assembly that can be produced at lower cost than tooling for injection moulding.